Indo Powersys Pvt. Ltd.

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    Heavy-Duty Copper Bonded Rod for Long-Lasting & Reliable Chemical Earthing

    The Copper Bonded Earthing Rod – 250 Micron by Indo Powersys Pvt. Ltd. is a premium-grade earthing solution engineered for demanding applications. With extra-thick 250-micron copper bonding, this rod ensures maximum conductivity, durability, and corrosion resistance.

    This type of chemical earthing rod is ideal for locations with aggressive soil conditions, such as industrial zones, coastal areas, and heavy-load electrical installations.

    • 250-Micron Copper Layer – Maximum Life
    • Low Electrical Resistance
    • High Tensile Steel Core
    • Ideal for Chemical Backfill Applications
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    • 250 Micron Copper Earthing Rod
    • Copper Bonded Earthing Rod for Industry
    • Heavy-Duty Chemical Earthing Rod
    • Earthing Rod with Copper Coating
    • Copper Grounding Rod for Substation
    • Maintenance-Free Earthing Rod
    Product Features – Copper Terminal GI ElectrodeFeatures of 250 Micron Copper Bonded Rod
    • Extra Copper Thickness: The 250-micron bonding provides longer service life, making it ideal for harsh environments.
    • Molecular Bonding: Unlike electroplated rods, this rod has copper bonded at the molecular level, enhancing strength and conductivity.
    • Compatible with Chemical Earthing: Works efficiently with gel-based and bentonite backfill, ensuring low earth resistance even in dry soils.
    Applications
    • Industrial Manufacturing Units
    • Commercial Electrical Panels
    • Renewable Energy Plants (Solar/Wind)
    • Server Rooms & Data Centers
    • Telecom Tower Grounding
    • Residential Complexes & Villas
    Technical Specifications
    • Material Core: High Tensile Low Carbon Steel
    • Copper Bonding Thickness: 250 Micron (Electrolytic Grade)
    • Copper Purity: 99.9% Pure Copper
    • Rod Diameter: 17.2 mm / 25 mm
    • Rod Length: 1.5m / 3m / 4m (custom available)
    • Corrosion Resistance: Very High
    • Installation Method: With Backfill Compound (Bentonite/Gel)

    FAQ

    1. What is the benefit of 250-micron copper bonding?

    The thicker copper layer increases durability and enhances conductivity, ensuring a long-lasting earthing solution.

    250-micron rods offer better performance and corrosion resistance, especially in industrial and moisture-sensitive areas.

    Yes, it’s specially designed for use with chemical backfills like bentonite and earthing gel.

    Yes, especially in areas with high soil resistivity or frequent lightning strikes.

    Over 25 years when installed with proper backfill compound and maintained as per standards.